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Report Details
Product: Wafer Inspection System
Defect Type: Particle Contamination
Field of View (FOV): 50 mm x 50 mm
Defect Size: 0.5 µm
Cycle Time: 120 seconds
Systems to Integrate: MES, EAP, R2R

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Our technical team reviews each challenge to clarify requirements and propose the right validation approach.

Technical email lehang@vinaweb.com.vn General email info@eversmart.vn Mr.Holy +84 338 515 228 Mr. Dong + 84 988 664 379

Office 43 Lê Gia Định - Hà Nội

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Systems to integrate

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